PROUD aims at cooling the next generation of 3D AI chips.

PROUD SA

Incorporated

01.12.2021

Headquarters

Lausanne

To tackle the problem of heat management, we have invented an innovative method allowing epitaxial deposition of high-quality diamond directly on foreign substrates without any interlayer. Our diamond layer, with the highest heat dissipation capacity of any existing material, deposited on chips from manufacturers and foundries allows a direct upgrade in heat extraction, output power and efficiency.
Thus, thanks to our patented technology, our high-quality diamond can be directly integrated onto low-cost semiconductor substrate (such as silicon). Our diamond-based solutions aims to unleash the full power of the new generation of chips developed for AI and quantum computing without disruption of the value chain of our customers.